The thermal conductivities of blend-PI films containing ZnO nanoparticles have been investigated by researchers from Tokyo Institute of Technology for future electric and electronic applications.
The blend films obtained were composed of sulfur- and fluorine- containing PIs and exhibited distinct microphase-separated structures with a vertical double percolation morphology. These films had two principle advantages over conventional homo-PI systems. The smaller ZnO content in the blend-PI films conferred a larger thermal conductivity. Additionally, the thermal conductivity was larger in pristine (without ZnO nanoparticles) blend-PI films than homo-PI films. A higher thermal conductivity is advantageous for application in polymer dielectric materials, as it allows for better flexibility, light weight and higher electric insulation properties.
Interested to know more? Why not read the full article for free: D. Yorifuji and S. Ando, J. Mater. Chem., 2011, 21, 4402.
